CUI Devices’ Thermal Management Group today announced a new line of high performance Peltier modules that boasts superior performance and reliability, thanks to its innovative arcTEC™ structure. This unique construction utilizes a combination of thermally conductive resin between the ceramic and copper on the cold side of the module, high temperature solder, and larger P/N elements made from premium silicon ingot. The elasticity of arcTEC’s resin layer allows for thermal expansion and contraction during the repeated heating and cooling of normal operation, which reduces stress on the elements, resulting in a better thermal connection, superior mechanical bond, and no marked drop-off in performance over time. High temperature solder and larger silicon elements are incorporated to enable faster and more uniform cooling.

The CP20H, CP30H, CP39H, CP60H, and CP85H series all employ the arcTEC structure and range in size from 15 mm to 40 mm, with profiles as low as 3.1 mm. These thermoelectric modules are available with a ΔTmax of 77°C (Th=50°C) and current ratings ranging from 2.0 A to 8.5 A.

信頼性の高いソリッドステート構造、精密な温度制御、静音動作を特徴とするこれらの熱電冷却モジュールは、高密度、高電力の医療用途および産業用途、強制空冷を利用できない冷凍環境および密封環境での用途に最適です。

The CP20H, CP30H, CP39H, CP60H, and CP85H series are available immediately with prices starting at $15.53 per unit at 25 pieces through distribution. Please contact CUI Devices for OEM pricing.