CUI Devices Further Expands Thermal Management Portfolio with New Line of Heat Sinks

2017年5月30日


CUI Devices Further Expands Thermal Management Portfolio with New Line of Heat Sinks

CUI Devices’ Thermal Management Group today announced an expansion to its existing portfolio of Peltier devices and dc fans with the addition of a heat sink product line. The new line of aluminum heat sinks, available in both extruded and stamped versions, is compatible with TO-218, TO-220, TO-252, and TO-263 transistor packages. Designed to improve the heat dissipation of low and high power board level applications, these stampings and extrusions are conveniently measured under four conditions for thermal resistance, making it easier to select the optimal heat sink for natural convection or forced air cooled systems.

The extruded and stamped heat sinks offer tin plated or black anodized material finishes and are available with or without solder pins in vertical or horizontal orientations. Thermal resistances measured at 75°C ΔT in natural convection environments are as low as 4.49°C/W, while power dissipation ratings measure up to 16.7 W at 75°C ΔT in natural convection.

Along with their standard form factors and sizes, CUI Devices also offers a range of custom heat sink capabilities. With alternate production methods such as forging and die casting as well as extrusions and stampings, CUI Devices can create virtually any shape or profile to fit specific design needs. クリアおよびカラーアルマイト、クロメートパウダーコーティング、ニッケルまたは亜鉛めっきを含む、その他の様々な材質や処理もご利用いただけます。また、オプションでカスタムマウントパターン用の穴あけも行います。In addition, CUI Devices’ standard or custom heat sinks can be integrated with any of its current Peltier and dc fan offerings to achieve more complex thermal solutions.

“At CUI Devices, we see the development and expansion of our thermal management product line as a natural complement to our industry leading portfolio of power products,” stated Kraig Kawada, CUI Devices’ VP of Product Management. 「電力密度の増加によりアプリケーションの温度が上昇し続ける中、当社の現在のペルチェ素子とDCファンと共にこれらのヒートシンクを導入することで、増大しつつあるお客様の温度管理の課題に対応することができると信じています。」

The entire product line of extruded and stamped aluminum heat sinks is available immediately with prices starting at $0.17 per unit at 1000 pieces through distribution. Please contact CUI Devices for OEM pricing or custom solutions.

  

概要
Product name:Heat sinks
納期: 7週間のストック
対象ユーザー: 低電力および高電力のボードレベルアプリケーション
主な特長: 様々な標準的なフォームファクターとサイズ、カスタムオプションが利用可能
コスト: 販売代理店を通じて1000個単位で単価$0.17から

発表用画像

ウェブ | 印刷
 
Powered By OneLink