CUI Devices Expands Heat Sinks Portfolio with New Line of BGA Heat Sinks

2021年8月31日


CUI Devices Expands Heat Sinks Portfolio with New Line of BGA Heat Sinks

CUI Devices’ Thermal Management Group today announced the continued expansion of its heat sinks product portfolio with the addition of BGA heat sinks. Compatible with ball grid array (BGA) devices, the HSB family supports a wide range of sizes from 8.5 mm x 8.5 mm up to 60 mm x 60 mm with profiles from 6 mm up to 25 mm. Like its existing line of board level heat sinks, these new BGA heat sink models are conveniently measured under four conditions for thermal resistance, making it easier for designers to select the optimal heat sink for their natural convection or forced air cooled system.

CUI Devices’ BGA heat sinks are made from aluminum with a black anodized finish and feature adhesive mounting styles. Thermal resistances measured at 75°C ΔT in natural convection environments range from 6.41 to 39.1°C/W, while power dissipation ratings range from 1.92 up to 11.69 W at 75°C ΔT in natural convection.

The HSB models are available immediately with prices starting at $0.42 per unit at 1000 pieces through distribution. OEM価格についてはCUI Devicesまでお問い合わせください。

For helpful resources and tools on thermal management, check out our Resource Library that houses a range of blog posts, videos, and more.

概要
製品名:BGAヒートシンク
納期: 在庫は8週間分
対象ユーザー: Ball grid array applications
主な特長: Measured under four conditions for thermal resistance, variety of sizes
コスト: $0.42 per unit at 1000 pieces through distribution

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